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Study of the property of Sn-Ag-Sb-Zn lead-free solder containing trace elements
Author(s): 
Pages: 730-733
Year: Issue:  5
Journal: MATERIALS SCIENCE AND TECHNOLOGY

Keyword:  Sn-37Pb钎料Sn-Ag-Sb-Zn焊料力学性能物理性能;
Abstract: 在Sn-Ag-Sb-Zn焊料合金中添加微量元素P、Bi、In和Ga,进行了力学性能和物理性能试验.结果表明:试验合金的密度比Sn-37Pb合金降低9.26%-10.55%;剪切强度比Sn-37Pb合金增加6%-51.3%;但熔点有所提高,结晶温度在6.32-7.88℃之间.微量元素的加入对合金的润湿性能有所改善;并能明显提高接头剪切强度.新开发的焊料合金的综合性能已经超过了Sn-37Pb焊料.
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