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Study of the property of Sn-Ag-Sb-Zn lead-free solder containing trace elements
Author(s):
WU An-ru
,
XIA Chang-qing
Pages:
730
-
733
Year:
2007
Issue:
5
Journal:
MATERIALS SCIENCE AND TECHNOLOGY
Keyword:
Sn-37Pb钎料
;
Sn-Ag-Sb-Zn焊料
;
力学性能
;
物理性能
;
Abstract:
在Sn-Ag-Sb-Zn焊料合金中添加微量元素P、Bi、In和Ga,进行了力学性能和物理性能试验.结果表明:试验合金的密度比Sn-37Pb合金降低9.26%-10.55%;剪切强度比Sn-37Pb合金增加6%-51.3%;但熔点有所提高,结晶温度在6.32-7.88℃之间.微量元素的加入对合金的润湿性能有所改善;并能明显提高接头剪切强度.新开发的焊料合金的综合性能已经超过了Sn-37Pb焊料.
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