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shen ya wei mi ban dao ti qi jian zhi zao de zui xin gong yi ji she bei
Pages: 27-31
Year: Issue:  4
Journal: 天津市科委

Keyword:  深亚微米半导体器件工艺设备;
Abstract: 介绍了深亚微米(035/025/018μm)半导体器件制造的最新工艺及设备,包括新一代CMOS工艺、FOND工艺、PSM技术、电子束光刻工艺、X射线光刻工艺、Cu互连技术和圆片老化筛选工艺及设备。
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