The server is under maintenance between 08:00 to 12:00 (GMT+08:00), and please visit later.
We apologize for any inconvenience caused
Login  | Sign Up  |  Oriprobe Inc. Feed
China/Asia On Demand
Journal Articles
Laws/Policies/Regulations
Companies/Products
Bookmark and Share
shen ya wei mi ban dao ti qi jian zhi zao de zui xin gong yi ji she bei
Author(s): 
Pages: 27-31
Year: Issue:  4
Journal: 天津市科委

Keyword:  深亚微米半导体器件工艺设备;
Abstract: 介绍了深亚微米(035/025/018μm)半导体器件制造的最新工艺及设备,包括新一代CMOS工艺、FOND工艺、PSM技术、电子束光刻工艺、X射线光刻工艺、Cu互连技术和圆片老化筛选工艺及设备。
Related Articles
No related articles found