ELECTROPLATING & FINISHING 2003 Vol.22 Issue 3

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电镀与涂饰
ELECTROPLATING & FINISHING

Year 2003 Volume 22

Issue 3

Plasma enhanced micro arc oxidation on the surface of aluminum alloys (铝合金表面等离子微弧氧化处理技术)

LAI Yongchun, SHI Xiuling, HUA Ming

.................. page:1-3

Decorative gold plating process of Si-Al Alloy Casting artware (铝硅合金铸造工艺品装饰镀金工艺)

YANG Zhongdong, LI Changye, LI Guoxi, WANG Zuomin

.................. page:4-6,13

LJ-4 long-life additive for alkaline etching and its application (LJ-4长寿碱腐蚀添加剂的研制与应用)

ZHOU Yingjie

.................. page:7-10,17

Electroplating process of gun-black color on die-casted aluminum alloy (压铸铝合金枪黑色电镀工艺)

HUA Shufang

.................. page:11-13

PANI/Cu conductive polymer composites prepared by electroless deposition (化学复合镀PANI/Cu导电聚合物复合材料)

HE Ying, WANG Junan, CHEN Minhua

.................. page:14-17

Hardness and corrosion resistance of electroless Ni deposits with different phosphorus concentration (不同磷含量化学镀镍层的硬度和耐蚀性能)

HU Xinguo, WANG Dianlong, DAI Changsong, CAI Yaguang

.................. page:18-21

Approach of quality improvement in electroless nickel plating of aluminum shell of electric connector (提高电连接器铝外壳化学镀镍质量的途径)

SHEN Fu

.................. page:22-24,27

Study of electroless nickel-phosphorus plating on neodymium-iron-boron permanent magnet (Nd-Fe-B永磁体化学镀Ni-P合金工艺研究)

ZHANG Tianshun, ZHANG Jingqiu

.................. page:25-27

Critical factors of electroless nickel plating in industrial application (化学镀镍在工业生产应用中的要素)

ZHANG Huixin

.................. page:28-31

Electrodeposition of Ni-Ce-P alloy from aqueous solution (水溶液中电沉积Ni-Ce-P合金)

TANG Liming, WANG Lingling, HUANG Weiqing, GAO Xuebao, LI Xiaofan

.................. page:32-34,61

Study of bright cyanide copper plating (氰化物光亮镀铜工艺的研究)

LI Jiazhu

.................. page:35-38

A new process of non-cyanide gold-imitation plating (一种无氰仿金电镀新工艺)

WANG Shaolong, LONG Jinming, GUO Zhongcheng, LI Ailian

.................. page:39-40,67

Study of low cyanide bright gold plating process with pulse current (低氰脉冲光亮镀金工艺研究)

WANG Xinquan, HUANG Gaoshan, LIANG Ying

.................. page:41-43

Study status and prospect of tin alloys depositing process (锡合金镀层工艺的研究现状及展望)

XU Ruidong, WANG Junli, XUE Fangqin, HAN Xiayun, GUO Zhongcheng

.................. page:44-50

Rapid determination of micro iron in acid copper plating bath by spectrophotometry (光度法快速测定酸性镀铜液中的微量铁)

QIU Shan, QIU Xingchu, HUANG Shuming

.................. page:51-52

Opinions of quality improvement on plastics electroplating (提高塑料电镀质量的认识)

HE Changlin

.................. page:53-54,56

Pretreatment of aluminium alloy plating (铝合金电镀前处理新工艺)

LUO Yaozong

.................. page:55-56

Improvement of sulfuric acid anodizing process for aluminum and aluminum alloy (铝及铝合金硫酸阳极化工艺的改进)

WEN Sixiong

.................. page:57-58

Sectionalized chromium plating of big parts' inside hole (大型工件内孔分段镀铬生产实践)

XIAN Dongsheng, YI Jingwei

.................. page:59-60

Stripping of defective layers and chromium re-plating (不合格镀层的退除和补镀)

ZHENG Ridong, ZHANG Weifeng

.................. page:60-61

biao mian chu li qi kan zong lan (表面处理期刊纵览)

.................. page:62-63

iso/ts 16949 jian jie (ISO/TS 16949简介)

.................. page:63

zhong guo zhuan li xin xi (中国专利信息)

.................. page:64-67

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