Electroplating & Finishing 2020 Vol.39 Issue 19

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电镀与涂饰
Electroplating & Finishing

Year 2020 Volume 39

Issue 19

Tribological properties of ion-plated AgPd film on GR660 high-strength steel for nuclear power (核用GR660高强钢表面离子镀AgPd膜层的摩擦学性能)

QU Jing, XIE Faqin, GAO Guangrui, WANG Baoyun, HU Dan, WENG Te

.................. page:1307-1311

Effect of ferrous ion on electrocrystallization behavior of nickel in industrial electrolyte (亚铁离子对工业电解液中镍电结晶行为的影响)

XU Yangtao, ZHU Zhenxu, LIU Zhijian, WANG Yaning

.................. page:1312-1318

Measures to improve corrosion resistance of nickel coating on low-carbon steel (改善低碳钢镀镍层耐蚀性的方法)

ZHU Wanyu, HUANG Hao, SHI Qingqing, LI Yunshi, ZHAO Jingxun

.................. page:1319-1321

Process for pearl chromium plating on aluminum alloys with trivalent chromium electrolyte (铝合金零部件三价铬镀珍珠铬工艺)

GUO Chongwu, ZHOU Aijun

.................. page:1322-1327

Simulative study on high-speed tin electroplating process in methanesulfonate electrolyte (甲基磺酸盐高速电镀锡工艺仿真研究)

YUE Chongxiang, XU Xiaohan, LIU Xinyuan, LI Hualong

.................. page:1328-1332

Effect of sulfuric acid on cleanliness of methanesulfonic acid electrolyte for high-speed tin electroplating (硫酸对甲基磺酸体系高速镀锡液清洁度的影响)

WANG Zhenwen, SUN Yu, WU Minghui, ZHOU Baoxin, FANG Yuan

.................. page:1333-1336

Effect of passivation charge on timeliness of surface properties of tinplate (钝化电量对镀锡板表面性能时效性的影响)

LU Yongliang

.................. page:1337-1339

A chemical roughening process applied to bonding between rubber and metal (用于橡胶金属粘合的化学粗化工艺)

DENG Jianqing, ZHOU Tongli, ZHOU Chenglong, XIE Yanfei, LI Bin

.................. page:1340-1343

Effect of sintering on properties of nickel coating electroplated on surface of microwave vacuum electronic device (烧结处理对微波真空电子器件电镀镍层性能的影响)

ZHANG Shuai, WANG Xiaoxia, LUO Jirun, WU Zhijie

.................. page:1344-1347

Effect of calcination temperature on properties of electroless silver-plated copper particles (煅烧温度对化学镀银铜粉性能的影响)

LIN Jiali, ZHANG Ying, CAO Mei, GONG Chuliang

.................. page:1348-1351

Study on copper etching solution for copper-plated silver nanowire conductive film (镀铜银纳米线导电薄膜铜层蚀刻液研究)

LIANG Yuxuan, ZHANG Xiaodong, YAN Guodong, YANG Zhao

.................. page:1352-1356

QC group activity to improve the first pass yield of T3 stamping parts after surface treatment (以提高T3材料冲压件表面处理一次成功良品率为课题的QC小组活动)

LI Fei, ZHANG Pan, ZHANG Shouwei, YU Jiang, ZHANG Guofan, YANG Yabo, YANG Liqiang

.................. page:1357-1361

Treatment of comprehensive electroplating wastewater by micro-magnetic flocculation and sedimentation (微磁絮凝沉淀工艺处理综合电镀废水)

XU Shaohua, LIN Tiansheng, ZHANG Hongying

.................. page:1362-1366

Adsorption of lead ions by sodium alginate microspheres (海藻酸钠微球对铅离子的吸附)

AI Yafei, ZHANG Min, GUO Liqiang

.................. page:1367-1370

Process for utilization of tin electroplating sludge (电镀锡泥资源化利用工艺)

LIU Junmei, WANG Hailin

.................. page:1371-1373

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