Electroplating & Finishing 2018 Vol.37 Issue 4 - Table of Contents

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电镀与涂饰
Electroplating & Finishing

Year 2018 Volume 37

Issue 4

Effects of different buffer solutions on stability of sulfite-thiosulfate electroless gold plating bath and morphology of coating (缓冲剂对亚硫酸盐-硫代硫酸盐化学镀金液稳定性及镀层形貌的影响)

LYU Ze-man, CHANG Ren-ke, WANG Bing-yi, TAN Gui-zhen, HAO Zhi-feng, DING Qi-heng, KE Yong

.................. page:155-159

Electroless nickel pre-plating as a substitute for palladium activation before electroless nickel plating on copper patterns of printed circuit boards (印刷电路板铜电路表面化学镀镍前预镀镍替代无钯活化)

YAO Jun-he, HE Xiang-zhu, CHEN Yun-yi, TANG Xu-dong, PENG Sheng-long

.................. page:160-164

Factors affecting the thickness-to-width ratio of microstrip in electroplating of thin film circuit (薄膜电路电镀过程中影响微带线厚宽比的因素)

SUN Lin, XIE Xin-gen, CHENG Kai, LIU Yu-gen

.................. page:165-167

Effect of temperature on properties of oxide film formed on 2198 aluminum-lithium alloy by anodization in sulfuric acid (温度对2198铝锂合金硫酸阳极氧化膜性能的影响)

CUI Bao-lei, WANG He-nan, GONG Xiao-liang, LIU Chun-zhong

.................. page:168-172

Study on methods for improving corrosion resistance of chromium-free zirconium-based chemical conversion film by electrochemical impedance spectroscopy (用电化学阻抗谱研究提高锆基无铬化学转化膜耐蚀性的方法)

XU Zi-qian, LI Ming-fang, MA Hong-ting, XIN Gang

.................. page:173-177

Preparation of photocatalytic modified graphene oxide thin film by dip coating and its characterization (浸渍提拉法制备改性氧化石墨烯光催化薄膜及其性能表征)

GU Hao-chen, ZHENG Yan-yin, LIU Yang-yang, YANG Pei-yan

.................. page:178-183

Zinc-nickel alloy electroplating of antenna mounting support (天线安装支架电镀锌镍合金)

GAO Liang-an

.................. page:184-186

Cause analysis and countermeasures for paling of barrel plated zinc coating on screw and its blackening after neutral salt spray test (螺丝滚镀锌镀层发白和中性盐雾试验后发黑的原因分析与对策)

MAO Hong-yu, LI Zhen, WANG Gang-da

.................. page:187-189

Removal of cadmium ions from wastewater discharged from cyanide-free potassium chloride cadmium electroplating by chelation precipitation (螯合沉淀法去除氯化钾无氰镀镉废水中的镉离子)

GUO Chong-wu, DAI Peng-min

.................. page:190-192

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