Electroplating & Finishing 1993 Vol. Issue 3

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电镀与涂饰
Electroplating & Finishing

Year 1993

Issue 3

Electrodeposition of Coloured Copper (彩色镀铜)

Wu Tian-cai

.................. page:1-4

Quality Control in Electroplating of Zinc Alloy Die Castings (锌合金压铸件电镀质量控制)

Yi Hul-ling, Tan Chang-ming

.................. page:5-8

Passivation of Zinc Alloy Die Castings (锌合金压铸件钝化工艺)

Sun Ming-xing, Liu Yao-nian

.................. page:9-12

Study of Silver-based Composite Coating——A New Material for Electric Contacts (新型电触点材料——银基复合材料研究)

Qian Da-ren, Li Jing-hong

.................. page:13-18

Repairing Process for Defective Nickel Deposits (不合格的镀锌层的修复工艺)

Fang Wei-nmi

.................. page:18

A New Process for Electrodeposition of Decorative Black-Pearl Coloured Film (装饰性黑珍珠电镀新工艺的研究)

Jiang Tai-xiang, Zhang Qiu dao, Li Xiao-fei, Li Jun, Hu Xin-guo

.................. page:19-21

On the Electrodeposition Behavior, of Zn-Ti Alloy from Baths Containing Zinc Sulfate, and Sodium Chloride (在含硫酸锌和氯化钠的槽液中Zn-Ti合金电沉积行为的研究)

Fang Bei-long

.................. page:22-25

Metallic Corrosion and New Techniques in Cathodic Protection (金属腐蚀与阴极防护新技术)

Wei Bin-hai, Chu Rong-bang, Tan Guo-hua

.................. page:26-32

ti gao dian du xiao lv de jin ru shi hui liu bang (提高电镀效率的浸入式汇流棒)

WU Hailing

.................. page:32

Ultra-fast Nikel Brush Plating Replenished with Soluble Anode (使用可溶性阳极的自补偿超快镍电刷镀)

Fei Jing-yin, Guo Zhong-ying

.................. page:33-35

Rapid Determination of Chloride lon Concentration in Copper and Its Alloy Surface Treatment Solutions (铜和铜合金处理液中氯离子浓度的快速测定)

Xu Jia-yuan

.................. page:36-38

dxj xian cai du xi ji zai nan jing tong guo jian ding (DXJ线材镀锡机在南京通过鉴定)

CHU Rongbang

.................. page:38

Analysis of Iron Impurity in Conventional Electroplating Solutions (常用电镀溶液中铁杂质的分析方法)

Zhang Xian-chang

.................. page:39-42

Precautions against Hydrogen Brittleness in Electroplating Parts (电镀零件防氢脆的工程控制措施)

Zhou jin-ba

.................. page:43-53

The Effect of Impressed Magnetic Field on Electrodeposition (外加磁场对电沉积的影响)

Tang Chun-hua

.................. page:54-60

Process for Through Hole Plating of Printed Wiring Board (印制线路板孔金属化电镀工艺)

Cai Ji ping

.................. page:61-65

Hard Chromium Plating of Big Workpieces Using Multiple Sets of Rectifiers (用多台整流器对大工件镀硬铬)

Deng Xiu-xu

.................. page:65-67

Application of Orthogonal Array in Electroplating Engineering (正交试验法在电镀工程中的应用)

Wu Shui-gou

.................. page:68-71+53

Practice of Electrocoating (电泳涂装工艺实践)

Li Xian-cheng

.................. page:72-74+60

zhong guo zhuan li xin xi (中国专利信息)

.................. page:75-80

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