Electroplating & Finishing 2015 Vol. Issue 4

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电镀与涂饰
Electroplating & Finishing

Year 2015

Issue 4

Study on additive for white copper-tin alloy electroplating from pyrophosphate electrolyte (焦磷酸盐溶液体系电镀白铜锡的添加剂研究)

GUO Yan, ZENG Zhen-ou, XIE Jin-ping, FAN Xiao-ling

.................. page:171-175

ban mian fei di kou quan ling qu tong zhi (版面费抵扣券领取通知)

.................. page:175-175

Study on formulation of stripping solution for aluminum coating on surface of NdFeB magnet (NdFeB磁体表面镀铝膜层退镀液配方的研究)

CHEN Zi-he, DAI Ming-jiang, HU-Fang, LIN Song-sheng, HOU Hui-jun

.................. page:176-180

Preparation of biodegradable environmental-friendly micro-emulsion cutting fluid for magnesium alloys (可生物降解的环保型镁合金微乳化切削液的制备)

CHEN Yu-ming, ZHOU Jian-hui, ZHOU Yu-cheng, SUN Xue-fei

.................. page:181-188

2015 nian dian du yu tu shi ban yue kan bu ding qi shi (2015年《电镀与涂饰》（半月刊）补订启事)

.................. page:188-188

Electroplating of connectors with deep micro-holes (接插件微孔深孔电镀工艺技术)

ZHANG Yong-qiang, JIANG Wei-gang

.................. page:189-195

guang zhou shi er qing gong ye ke xue ji shu yan jiu suo guang zhou hong zuo ke ji gu fen you xian gong si lian he zhao pin (广州市二轻工业科学技术研究所、广州鸿葳科技股份有限公司联合招聘)

.................. page:195-195

Effect of gold thickness on ENIG PCB solder spread and joint reliability (金层厚度对沉金PCB焊锡延展性及焊点可靠性的影响)

LI Fu, LI Bin

.................. page:196-200

Descaling of oxide-coated titanium anode for manufacturing of electrolytic copper foils (电解铜箔用涂层钛阳极表面结垢的去除)

XU Hai-qing, HU Yao-hong, CHEN Li-ge, QIN Zu-zu, LIAO Lei-hua, ZHANG Zhao-xian

.................. page:201-205

Discussion on technological requirements of primer-free vacuum aluminum plating on automotive lamps (浅谈汽车灯具无底涂真空镀铝的工艺要求)

TAO Yong-liang, LIU Xin-ling

.................. page:206-209

Discussion on the design of environmental management system for electroplating enterprises (电镀企业环境管理制度设计探讨)

WU Hong-feng

.................. page:210-212,213

shu xun (书讯)

.................. page:213-213

Study on protection measures in environmental impact assessment about electroplating project (电镀项目环境影响评价环保措施研究)

WANG San-ping, WANG Hao-yu, HAN Zhen, LI Yang

.................. page:214-216

Tin and tin alloy electroplating in electronic industry：present status and prospect (电子工业用锡及锡基合金电镀技术：现状及展望)

HE Yan-feng, LU Tong-juan, WANG Fang

.................. page:217-222

biao mian chu li xing ye fa lv fa gui ji xiang guan biao zhun hui bian tui jie (《表面处理行业法律法规及相关标准汇编》推介)

.................. page:222-222

Silver/gold gilding on black copper-an amazing technique in Yunnan (神奇的云南乌铜走银（金）工艺)

WU Shuang-cheng, CHU Rong-bang

.................. page:223-227

zhong guo biao mian gong cheng xie hui dian du fen hui jiao yu pei xun ji di 2015 nian liang qi zong 67 68 qi dian du ji shu zhen kong du mo ji shu hua yan yuan dian du fei shui zhi li xue xi ban bao ming kai xue tong zhi (中国表面工程协会电镀分会教育培训基地2015年两期（总67、68期）电镀技术、真空镀膜技术、化验员、电镀废水治理学习班报名开学通知)

.................. page:227-232

sheng ming (声明)

DIAN Duyutushibianjibu

.................. page:232-232

2015 nian guo nei wai du fu xing ye zhan hui ji jiao liu hui yu gao (2015年国内外镀覆行业展会及交流会预告)

.................. page:233-233

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