Electroplating & Finishing 2014 Vol.33 Issue 21

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电镀与涂饰
Electroplating & Finishing

Year 2014 Volume 33

Issue 21

Research on kinetics of tin electrodeposition in aqueous pyrophosphate electrolyte (焦磷酸盐溶液体系电沉积锡的动力学研究)

GUO Yan, ZENG Zhen-ou, XIE Jin-ping, FAN Xiao-ling

.................. page:907-910

Effects of different reductants for silver ink printing on preparation of printed circuit board by electroless copper plating on polyimide substrate (不同还原体系银油墨打印对聚酰亚胺基板化学镀铜制备印制电路板的影响)

CHEN Huan-wen, WEN Lin-sen, DENG Tian-liang, LIAO Li-jun, LIU Xiao-nan, ZHU Xiao-yuan, GONG Xiao-zhong

.................. page:911-914

Research on modification of vanadate conversion coating on magnesium alloy surface with sodium dodecyl benzene sulfonate (十二烷基苯磺酸钠对镁合金表面钒酸盐转化膜的改性研究)

CAO Wei-dong, GUO Rui-guang

.................. page:915-918

Process for plating double-layer chromium coating on TC2 titanium alloy (TC2钛合金表面电镀双层铬工艺)

ZHAO Li-cai, GAO Jing, SHA Chun-peng

.................. page:919-921

Cyanide-free silver plating on aluminum alloy substrates (铝合金无氰镀银工艺)

LI Guang-yan, HU Dong-wei, GE Xin

.................. page:922-924

Local thick-film hard anodizing process for aluminum alloys (铝合金局部厚膜硬质阳极化工艺)

SHU Wei-fa, ZHANG Hai-jin

.................. page:925-928

xin xi dong tai (信息动态)

.................. page:928,938,943-946,948

Development of environmentally friendly room temperature metal degreaser (常温环保型金属除油剂的研制)

LAI Li-chao, TANG Chun-bao, ZHANG Feng-ru

.................. page:929-931

Analysis on formation causes of copper particle defect on copper-plated printed circuit board (印制电路板电镀铜颗粒缺陷的成因分析)

ZHAN Shi-jing, ZHENG Fan, JIANG Jie-meng

.................. page:932-934

Treatment of nickel-containing electroplating wastewater by two-stage precipitation process (两级沉淀法处理电镀含镍废水)

CHEN Zhen-guo, WANG Xiao-jun

.................. page:935-938

Analysis on emission standard-compliant technologies for treatment of reverse osmosis concentrate produced during reclamation of electroplating wastewater (电镀废水膜分离浓液达标处理技术分析)

WANG Yu-long, CHEN Jian-yu, YU Jian, LIU Gang, HUANG Rong-xin

.................. page:939-942

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