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11 Records Found
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电镀与涂饰
Electroplating & Finishing
Year 2014
Volume
33
Issue
11
Preparation of Ti3+-doped TiO2 nanotube array and its electrochemical impedance spectroscopic study (Ti3+掺杂的TiO2纳米管阵列制备及其电化学阻抗谱研究)
YE Qiao
,
CAO Hua-zhen
,
LU Dong-hui
,
ZHENG Guo-qu
..................
page:
453
-
456,513
Alternating current electrodeposition of copper nanowire array by template method and its characterization (模板法交流电沉积铜纳米线阵列及其表征)
ZHANG Yanmei
,
HU Yong
,
HUANG Jiaqiang
,
WANG Guoqing
,
GUI Zuo
,
WANG Dafu
,
JIE Xiaohua
,
ZENG Peng
..................
page:
457
-
459
Structure and corrosion resistance of nickel-yttrium oxide composite coating prepared by brush plating (电刷镀镍-氧化钇纳米复合镀层的组织与耐蚀性)
LING Wen-dan
,
ZHAO Ping-tang
,
LI Zhi-pan
,
ZHANG Song-qi
,
LIANG Ke
..................
page:
460
-
463
Comparative studies on lead dioxide electrodes doped with different metals (不同金属掺杂二氧化铅电极的对比研究)
HUANG Cheng-si
,
XU Wei
,
DUAN Xiao-yue
..................
page:
464
-
467,513
Analysis on the causes of early failure of nickel plate for electrolytic coloring of aluminum alloys (铝合金电解着色用镍板失效原因分析)
HU Li-fen
,
FENG Hao
,
LIU Xin
..................
page:
468
-
469
Effects of complexants on electroless nickel-phosphorous plating on GH202 alloy (配位剂对GH202合金化学镀镍-磷的影响)
ZENG Fan
,
TAN Cheng-yu
,
LONG Ya-xiong
,
MA Can
..................
page:
470
-
473
Study on microetching of ABS plastic with MnO2-H2SO4-Na5P3O10 system prior to electroless copper plating (MnO2-H2SO4-Na5P3O10体系对化学镀铜前ABS塑料表面微蚀的研究)
BIAN Jia
,
WANG Zeng-lin
..................
page:
474
-
477
Palladium-free activation of silicon carbide before electroless nickel plating (碳化硅粉体化学镀镍前无钯活化工艺)
ZOU Zhong-li
,
GENG Gui-hong
..................
page:
478
-
481
Treatment of electroplating wastewater by activated carbons (活性炭处理电镀废水)
PENG Ming-zhi
..................
page:
482
-
486,513
Research progress of oxygen evolution anode for electrowinning applications (电积用析氧阳极的研究进展)
JIANG Guo-xiang
,
LEI Ting
,
YANG Chang-jiang
,
LI Shu-fang
..................
page:
487
-
491
xin xi dong tai (信息动态)
..................
page:
492
-
493
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