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Principle, application and research prospect of electroless copper plating
Author(s): 
Pages: 46-50
Year: Issue:  10
Journal: ELECTROPLATING & FINISHING

Keyword:  镀铜化学镀铜预处理非金属;
Abstract: 化学镀铜技术主要用作印制线路板孔金属化和塑料电镀,其镀层具有良好的延展性、导热性和导电性.介绍了化学镀铜的应用范围与发展.强调了化学镀铜预处理的必要性及要注意的几个方面:应用易清洗的油脂作防锈剂,低碳钢件用阳极电解除油,酸洗除油与碱性除油互补等.介绍了化学镀铜的一些常用体系及其主要组分.讨论了添加剂的影响.对非金属表面化学镀铜的研究进展进行了报道.提出了化学镀铜今后的研究重点.
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