The server is under maintenance between 08:00 to 12:00 (GMT+08:00), and please visit later.
We apologize for any inconvenience caused
Login  | Sign Up  |  Oriprobe Inc. Feed
China/Asia On Demand
Journal Articles
Laws/Policies/Regulations
Companies/Products
Bookmark and Share
Stress and Displacement Fields of the Mode Ⅲ Interface Crack Propagation in Bimaterial Disc
Author(s): 
Pages: 667-669,683
Year: Issue:  8
Journal: TRANSACTIONS OF BEIJING INSTITUTE OF TECHNOLOGY

Keyword:  复合材料Ⅲ型界面裂纹扩展应力场位移场;
Abstract: 对Ⅲ型界面中心裂纹的均匀各向同性脆性复合材料薄圆板裂纹扩展进行了研究.通过建立数学模型和基本方程,找出了边界条件,并用分离变量法进行求解,得到了裂纹尖端附近应力场和位移场的解析解.采用所建立的模型,针对实际可能出现的裂纹扩展问题进行了讨论.
Related Articles
No related articles found