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HDI packaging technology push testing technology development
Author(s): 
Pages: 13-14
Year: Issue:  4
Journal: ELECTRONIC PRODUCTS CHINA

Keyword:  集成电路封装测试技术自动光学检测技术自动X-射线检测;
Abstract: 高密度封装技术的飞速发展给测试技术提出了新的挑战.为了应对挑战,新的测试技术不断涌现.本文主要介绍了几种新型测试技术的特点,并对未来测试技术的发展趋势及方向进行了初步分析.
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