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The Interface Reduction and Bonding Strength of CuW/CrCu Self-Elastic Solid Contact
Author(s): 
Pages: 13-17
Year: Issue:  4
Journal: ELECTRICAL ENGINEERING MATERIALS

Keyword:  CuW/CrCu界面还原结合强度;
Abstract: 自力型CuW/CrCu整体弧触头的立式熔接工艺是指在立式气氛可控烧结炉内对CuW触头部分与尾部CrCu熔结的过程,是制造整体触头的关键技术.CuW/CrCu整体弧触头的立式熔接首先要对CuW合金的界面进行还原处理,以清除在熔接前由于种种原因界面上出现的氧化夹杂等,确保界面的良好结合;尾部CrCu的Cr含量是影响CuW/CrCu界面结合强度的另一重要因素,适当的Cr含量是必须的.
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