Intermediate temperature setting solvent-free epoxy resin structural adhesive with high tenacity and high peeling strength modified by PU
Author(s): WANG Chao, LI Li, HUANG Yudong
Pages: 109-111
Year: 2003 Issue: 3
Journal: JOURNAL OF NATURAL SCIENCE OF HEILONGJIANG UNIVERSITY
Keyword: 聚氨酯; 改性; 环氧树脂; 结构胶粘剂;
Abstract: 介绍了一种无溶剂糊状聚氨酯改性环氧树脂结构胶粘剂,这种胶粘剂具有IPN结构,采用直链端异氰酸酯聚氨酯改性环氧树脂,以4,4-二氨基二苯甲烷和间苯二胺共混物为固化剂,120℃固化2h,常温剪切强度46MPa;130℃时剪切强度13.2MPa,室温剥离强度可达120KN/m,而且常温粘度低于CTBN改性环氧树脂胶粘剂,粘接强度高于CTBN改性环氧树脂胶粘剂,成本低于CTBN改性环氧树脂胶粘剂.
Pages: 109-111
Year: 2003 Issue: 3
Journal: JOURNAL OF NATURAL SCIENCE OF HEILONGJIANG UNIVERSITY
Keyword: 聚氨酯; 改性; 环氧树脂; 结构胶粘剂;
Abstract: 介绍了一种无溶剂糊状聚氨酯改性环氧树脂结构胶粘剂,这种胶粘剂具有IPN结构,采用直链端异氰酸酯聚氨酯改性环氧树脂,以4,4-二氨基二苯甲烷和间苯二胺共混物为固化剂,120℃固化2h,常温剪切强度46MPa;130℃时剪切强度13.2MPa,室温剥离强度可达120KN/m,而且常温粘度低于CTBN改性环氧树脂胶粘剂,粘接强度高于CTBN改性环氧树脂胶粘剂,成本低于CTBN改性环氧树脂胶粘剂.
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