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Research and Development of Low Cost and New Type of Q460 Grade Medium and Heavy Plate-UP460 Strengthened with Fine Grain
Author(s): 
Pages: 1-4
Year: Issue:  1
Journal: WIDE AND HEAVY PLATE

Keyword:  中厚钢板TMCP晶粒细化微合金化;
Abstract: 介绍了一种新型低成本Q460级中厚钢板-UP460的研制情况,其化学成分以传统16Mn钢为基础,不添加V元素,添加约0.02%的Nb元素,采用控轧控冷工艺(TMCP)主要依靠晶粒细化和析出强化提高钢材温度.试生产厚度规格为12~30 mm的中厚钢板,力学性能满足GB/T1591-94要求.与传统Nb-V复合微合金化Q460级中厚板相比,合金元素用量大幅度降低,经济效益增加.
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