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re shi xiao ji dian qian yi dui bu tong ti ji snagcu wei han dian qiang du ying xiang yan jiu
Author(s): 
Pages: 24-27
Year: Issue:  10
Journal: Welding Technology

Keyword:  微焊点无铅钎料SnAgCu强度热时效电迁移影响;
Abstract: 研究了不同体积(高度)无铅钎料SnAgCu微焊点分别经热时效和电迁移后其抗拉强度及组织变化规律。结果表明,SnAgCu微焊点在服役过程中热时效会导致晶粒粗大,电迁移在阴极界面会形成微空洞和微裂纹,晶粒粗大和缺陷的形成使微焊点强度逐渐下降;微焊点体积越小,相同服役条件下两侧铜基母材对微焊点中钎料的力学拘束越大,拘束效应越强,强度下降值就越小。
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