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Study on the Preparation and Properties of Conductive Adhesive for LED Packaging
Author(s): 
Pages: 24-28
Year: Issue:  3
Journal: Precious Metals

Keyword:  metal materialsconductive adhesiveflake silver powdervolume resistivityshear strength;
Abstract: By the studing of the influential factors of the resin system, curing agent and flake silver powder on the mechanical properties, conductivity and weather resistance properties, a conductive adhesive which could be stored at room temperature was prepared finally. The results showed that the conductive adhesive with 75% silver powder, the quality ratio of EP resin to PAI resin being 80/20, the quality ratio of 4, 4-diaminodiphenyl methane to 4,4-oxydianiline being 60/40, could meet the technical indicators. After being tested in a LED packaging factory, the bulk production could meet the application requirements of the enterprise.
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