The server is under maintenance between 08:00 to 12:00 (GMT+08:00), and please visit later.
We apologize for any inconvenience caused
Login  | Sign Up  |  Oriprobe Inc. Feed
China/Asia On Demand
Journal Articles
Laws/Policies/Regulations
Companies/Products
Bookmark and Share
System on Package Design Based on Vertical Interconnection of Fuzz-button
Author(s): 
Pages: 135-137,186
Year: Issue:  3
Journal: Electronics Process Technology

Keyword:  fuzz-buttonvertical interconnectionsystem on package;
Abstract: Small vertical interconnect technology is one of the most important technologies in system board-level integration. Developed a solder-less vertical interconnect structure-fuzzy button, the high-frequency signal transmission between the package and the circuit board is achieved. The size and electrical properties of fuzzy buttons are designed using three-dimensional electromagnetic simulation and optimization, and the corresponding processes are also researched. Good results of the integrated approach are verified by testing, it has the advantages of small size, easy assembly and maintenance, being considered has wide applications in system 3D integration and miniaturization design of RF/microwave circuit.
Related Articles
No related articles found