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Interconnect Techniques between Thin-Film Sensors and Leads Using Parallel Micro Gap Welding
Author(s): 
Pages: 125-127,134
Year: Issue:  3
Journal: Electronics Process Technology

Keyword:  thin-film sensorparallel micro gap weldingelectrode force;
Abstract: The NiCr thin-films (5 mm thick) and Ni leads with 5 mm-diameters were successfully bonded using a parallel micro gap welding method for thin-film sensor interconnects. According to our experimental results, welding joints between the NiCr thin-films and Ni leads were achieved with strong currents (100~60 A) and short duration (0.5~2 ms). The tensile force is high enough. Effects of the electrode force on the welding quality were investigated. It is necessary to choose appropriate electrode forces during welding process.
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