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Generation and Growth of Tin Whisker in Surface of Pin Frame of QFP During Heat Test
Pages: 138-140,159
Year: Issue:  3
Journal: Electronics Process Technology

Keyword:  Sn whiskerQFP (quad flat package)pure Sn coatinggeneration;
Abstract: With the results of scanning electron microscopy (SEM), the formation and growth of tin whisker from the surface of pin frame of QFP (quad flat package) during four types of heat treatments was investigated. It was shown that the account of tin whisker increased because of the interface cracks and large field of alternative stress in the interface caused by the mismatch of the coefficient of expansion (CTE) between Sn, SnO2 and Cu after temperature cycling test. The growth of tin whisker was introduced by increase of oxidation degree of interface.
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