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Influence of thermal effect on reliability for PBGA solder joints under the condition of thermal cycling
Pages: 8-11+5
Year: Issue:  4
Journal: Welding Technology

Keyword:  solder jointsplastic ball grid arraythermal effectreliability;
Abstract: In order to study the reliability of the lead-free SAC405 solder joints for the PBGA packaging under the thermal cycle between-55 ℃ and 125 ℃, the finite element method was used to discuss the influence of the thermal effect on the stress and strain distribution of solder joints, and the crack growth was also analyzed. The results showed that:( 1) thermal effect had certain influence on the stress and strain distribution of PBGA packaging;( 2) the maximum equivalent stress of solder joints located on its upper surface, and the critical solder joints was corresponding to the most distant distance from the symmetrical center of the chip;( 3) the cracks formed on the substrate side, expanded from the outside to the inside of the solder joints along the bonding pad. Test results were consistent with the simulation results, which verified the validity of the simulation results.
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