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Study on joint properties of SnAgCu solder alloy
Pages: 5-7+105
Year: Issue:  4
Journal: Welding Technology

Keyword:  SnAgCuNi contentmelting propertymechanical propertycreep property;
Abstract: Sn2.5Ag0.7Cu0.1RE-x Ni solder alloy of different Ni content was prepared. After testing the microstructure,melting and mechanical property of the solder alloy, the copper was soldered, and then the creep properties of the soldered joints of different Ni content was tested and analyzed. The results showed that the addition of Ni was beneficial to the improvement of the mechanical property and refining microstructure of the solder alloy, but it had little effect on the melting property; under the conditions of this experiment, when the Ni content was 0.05% and1%, the creep property of the joints were better than that of the other Ni contents.
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