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On thick silver electroplating in thiosulfate bath
Pages: 44-45
Year: Issue:  1
Journal: Electroplating & Finishing

Keyword:  cyanide-free silver electroplatingthiosulfatethicknessdeposition rate;
Abstract: A thiosulfate (also called hyposulfite) silver electroplating process has been applied to treat copper workpieces in a company from the 1970s. It has disadvantages of slow deposition and low production efficiency due to the fact that its allowable current density is only 0.1-0.3 A/dm2. To solve this problem, a new process for thick silver electroplating was developed. Its bath composition and operation conditions are as follows: silver nitrate 55 g/L, anhydrous sodium sulfite 40 g/L, sodium thiosulfate 500 g/L, potassium citrate 40 g/L, temperature 30 °C, pH 5-6, cathodic current density 0.4-1.0 A/dm2, and cathode-to-anode area ratio 1:2 to 1:3. The deposition rate is doubled after using the new process.
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