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Improvement of Adhesive Strength for Back Side Electrode Silver Aluminum Interface
Pages: 7-12
Year: Issue:  6
Journal: Electrical Engineering Materials

Keyword:  背面银浆银铝界面脱落玻璃量;
Abstract: 针对使用的铝浆与众多背面银浆出现不匹配,在银铝界面处存在铝粉脱落的现象,采用扫描电镜(SEM)和能谱检测(EDS)对银铝界面进行表面形貌观测和成分表征,研究了铝粉脱落的机理.通过改变玻璃和添加剂的配比,制备出6种不同背面银浆样品.并对各样品的匹配性、附着力和相对电阻率进行了测试.结果表明:当样品中玻璃占比达到4.5%,不加添加剂时,银铝浆匹配性达到最优,同时保证了产品较好的附着力和相对电阻率等.
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