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Application of novel coarsening solution to diamond/copper matrix composite
Author(s): 
Pages: 1181-1183
Year: Issue:  20
Journal: Electroplating & Finishing

Keyword:  diamondcopper matrix compositeelectroless nickel platingcoarseningadhesionthermal resistance;
Abstract: The coarsening process for surface of diamond/copper matrix composite during pretreatment prior to electroless plating was studied. A JG-01 coarsening solution composed of sodium nitrite 5 g, sodium hydroxide 5 g, tris(2-hydroxyethyl)amine 0.3 g, carbamide peroxide 0.4 g, potassium ferrate 0.5 g, and deionized water 88.8 g was developed. The effects of the novel coarsening process and a traditional coarsening process on the surface morphology and properties of the electroless nickel deposit on the surface of diamond/copper matrix composite was studied by scanning electron microscopy as well as adhesion and thermal resistance tests. Compared with the traditional coarsening process, the novel coarsening process has a better roughening effect for the surface of diamond/copper matrix composite. The nickel deposit obtained after coarsening is level and bright, and has good adhesion and thermal resistance. The novel coarsening process can effectively resolve the problems of skip plating and poor brightness, adhesion, and thermal resistance existing in traditional coarsening process.
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