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Characteristics of dual-frequency capacitively coupled SF6/O2 plasma and plasma texturing of multi-crystalline silicon
Pages: 365-373
Year: Issue:  6
Journal: Chinese Physics B

Keyword:  dual frequency capacitively coupled plasmaplasma texturingmulti-crystalline siliconelectron density;
Abstract: Due to it being environmentally friendly, much attention has been paid to the dry plasma texturing technique serving as an alternative candidate for multicrystalline silicon(mc-Si) surface texturing. In this paper, capacitively coupled plasma(CCP) driven by a dual frequency(DF) of 40.68 MHz and 13.56 MHz is first used for plasma texturing of mc-Si with SF6/O2gas mixture. Using a hairpin resonant probe and optical emission techniques, DF-CCP characteristics and their influence on mc-silicon surface plasma texturing are investigated at different flow rate ratios, pressures, and radio-frequency(RF)input powers. Experimental results show that suitable plasma texturing of mc-silicon occurs only in a narrow range of plasma parameters, where electron density n9e must be larger than 6.3 × 10cm-3and the spectral intensity ratio of the F atom to that of the O atom([F]/[O]) in the plasma must be between 0.8 and 0.3. Out of this range, no cone-like structure is formed on the mc-silicon surface. In our experiments, the lowest reflectance of about 7.3% for mc-silicon surface texturing is obtained at an [F]/[O] of 0.5 and ne of 6.9 × 109cm-3.
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