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hua xue du nie peng he jin ceng de han jie xing neng
Author(s): 
Pages: 14-17
Year: Issue:  3
Journal: Welding Technology

Keyword:  化学镀镍焊接性钎焊性化学沉积电学性能镀覆沉积速度合金镀层电镀镍扩散势垒;
Abstract: 本文讨论了化学镀镍硼合金层的镀覆原理及焊接性能。化学镀镍硼合金具有优良的钎焊性和键合性,钎焊时,可以使用活性焊剂和非活性焊剂,超声压焊的效果也很好。同时,在多种环境下仍保持良好的焊接性能和电学性能,因此化学镀镍硼合金可在电子工业上代替黄金。
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