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zui da shi ji dian chen ji su du mai chong dian liu jin shu dian chen ji ji ben li lun zhi san
Author(s): 
Pages: 66-73
Year: Issue:  3
Journal: Electroplating & Finishing

Keyword:  沉积速度金属电沉积电流密度枝晶生长镀层厚度极限扩散电流沉积条件比用过电位沉积时间;
Abstract: 本文讨论了电流密度对镀层的表观粗糙和枝晶形成的影响。已经表明,在同样的电沉积条件和镀层厚度下,用脉冲电流比用直流电沉积所获得的镀层要平滑,甚至在比直流电沉积更高的电流密度下亦能得到平滑的镀层。同时也表明,当平均电流密度小于极限扩散电流密度,在具有良好分散能力的电解液中,在平滑的基体上,用脉冲电流能够得到平滑的镀层。
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