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suan xing guang liang du tong rong ye zhong lv li zi de chu li
Author(s): 
Pages: 29-30
Year: Issue:  1
Journal: Electroplating & Finishing

Keyword:  镀铜氯离子含量碳酸银化学反应方程式AgCl铜液非金属性硫酸铅外层电子工艺配方;
Abstract: <正> 对硫酸盐光亮镀铜工艺中过量的氯离子处理,目前,国内采用碳酸银沉淀和电解法二种,其化学反应方程式如下: 1.Ag2CO3+2HCl=2AgCl↓+CO2↑+H2O 2.2HCl电解H2↑+Cl2↑因上述二种方法,处理价格昂贵,所以,近来从国外引进了一种新方法;用锌粉处理,其机理则说法不一。八二年中旬,本厂酸性光亮镀铜槽(3600公升),由于误加试剂盐酸,使镀液中的氯离
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