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nie - zuo he jin du ceng
Author(s): 
Pages: 75
Year: Issue:  1
Journal: Electroplating & Finishing

Keyword:  合金镀层阴极镀层铜基体电沉积镀槽钼合金离子源镀覆过电位硫酸镍;
Abstract: <正> 本专利叙述导电性非常好的、耐腐蚀和低氢过电位的阴极镀层。这一阴极镀层是镀覆于铜基体上之镍-钼合金。最好是采用添加有一定量的钼的镍槽,使镍钼合金电沉积在铜基体上。钼的加入形式要能在水溶液中提供放电沉积离子的离子源。镀槽可以是含有20-150克/升镍盐(硫酸镍和氯
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