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Current Status of Lead-Free Solder Alloy
Author(s): 
Pages: 47-52
Year: Issue:  2
Journal: ELECTRONICS PROCESS TECHNOLOGY

Keyword:  无铅钎料微电子组装焊接;
Abstract: 无铅钎料是绿色电子产品的一个重要组成部分.本文综述了近年来国际上无铅钎料的发展动态,并为国内企业如何适应这一趋势提出了建议.
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