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Discussion of Soldering Technology for Mix-assembled Circuit Board
Author(s): 
Pages: 59-62
Year: Issue:  2
Journal: ELECTRONICS PROCESS TECHNOLOGY

Keyword:  表面贴装技术混装电路板焊接焊料焊剂工艺技术参数;
Abstract: 分析了SMT混装电路板所采用的主要焊接方式,着重就影响SMT波峰焊接质量的波峰焊机、工艺参数、焊料焊剂等主要工艺技术进行探讨.根据厦华电子公司的实际焊接情况,给出了波峰焊接的相关工艺参数,并对今后SMT焊接技术进行展望.
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