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SMT Line Configurations And Adhesive Dispensing Processes
Author(s): 
Pages: 71-74
Year: Issue:  2
Journal: ELECTRONICS PROCESS TECHNOLOGY

Keyword:  表面组装技术组装配置工艺粘接剂滴涂印刷;
Abstract: 主要论述了对于不同的PCB产品,可采用的不同的组装工艺、生产线配置方案及不同的粘接剂涂覆工艺,并针对粘接剂涂覆这一重要工艺进行了重点讨论.
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