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Sn-Ag Sn-Zn and Sn-Bi Lead-free Solder
Author(s): 
Pages: 75-76
Year: Issue:  2
Journal: ELECTRONICS PROCESS TECHNOLOGY

Keyword:  无铅焊料微电子组装环境保护;
Abstract: 随着微电子组装技术的发展,研制新型的和实用的无铅焊料替代传统的Sn-Pb焊料已成为近年来的研究热点.介绍了目前最常见的Sn-Ag、Sn-Zn和Sn-Bi为基体的无铅焊料并与传统的Sn-Pb焊料的性能进行了比较.
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