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Effect of Surface Morphology of Direct Bonding Copper Plate on Ultrasonic Wire Bondability
Pages: 304-310
Year: Issue:  8
Journal: Transactions of China Electrotechnical Society

Keyword:  Direct bonding copper platesurface morphologyultrasonic bondingbonding strengthbondability;
Abstract: DBC(direct bonding copper) plate, as an important part to fulfill electrical connection by using ultrasonic bonding technique in classical power module, has a wide application in high power electronic device module. As a result, the bondability of DBC plate has a vital influence on products’ rate and reliability. Previous studies focused on how the bonding parameters(power bonding, pressure bonding, bonding time) affect the performance of the bonding. However, few researches of surface morphology on the wire bondability were reported. This paper presents a study of the surface morphology of DBC plate on the ultrasonic wire bondability. The results of experiments show that the average distance between the microscopic irregularities(Sm) of the surface morphology of DBC plate has a very important influence on bondability. On one hand, better bondability will be abtained if the parameter Sm of the DBC plate surface is smaller. Otherwise, the bondability of DBC plate will be much worse. On the other hand, the bonding strength discreteness is decided by the surface roughness based on thesuccessful bonded, the smaller of the surface roughness is, the less discrete of the bonding strength is. Lastly, these results are analysed by using spatial spectrum method and tribology theory.
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