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Numerical Simulation of Flow and Heat Transfer in a Novel Polysilicon Reduction Furnace’s Baseboard
Author(s): Zhou Yang, Duan Lian, Huang Zheqing, Liu Chunjiang, School of Chemical Engineering and Technology, State Key Laboratory of Chemical Engineering, Tianjin University
Pages: 41-
47
Year: 2015
Issue:
1
Journal: Chemical Industry and Engineering
Keyword: polysilicon; heat transfer; numerical simulation; reduction furnace;
Abstract: Siemens process energy consumption can be limited by furnace’s baseboard temperature. An analysis based on mass and heat transfer theory,on different types of baseboards and a new type of baseboard structure are studied in detail in this paper. This new type is contained of two chambers cut by a barrier where several sleeves are welded around the electrodes. When the furnace works,the cold water,which passes through the sleeves from the lower chamber to the upper chamber,takes the heat from the hot electrodes and the furnace’s baseboard. The baseboard temperature of higher degree of uniformity is realized in this type of baseboard,compared with the traditional ones. The effect of flow geometry parameters on heat transfer for turbulent flow in the sleeves with baffles inserts has also been investigated. Different flow geometry parameters of baffle width( W),baffle thickness( T),pitch( P) were varied parametrically during the experiments. Water,temperature of which is 300 K,was used as working fluid,while stainless steel was considered as sleeve and baffle material. The best effect of cooling performance is the type with the parameters of Wb= 1 mm,Tb= 1 mm,Pb= 10 mm; Wt= 1 mm,Tt= 1 mm,Pt= 10 mm and prompts 32% increase in heat transfer effect and 54% in uniformity of temperature.
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