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Study on curing kinetics of bisphenol A diallyl ether/bismaleimide resin
Author(s): 
Pages: 1-4
Year: Issue:  6
Journal: China Adhesives

Keyword:  bismaleimide(BMI)bisphenol A diallyl ether(BBE)curing kinetics;
Abstract: With BBE(bisphenol A diallyl ether)as modifier of BDM[4,4′- diamino diphenyl methane-BMI(bismaleimide)] resin,the viscosity and curing reaction kinetics process at different temperatures of BBE/BDMresin system were respectively investigated by rotational viscometer and non-isothermal DSC(differential scanningcalorimetry)method. The research results showed that the resin system had lower viscosity(less than 1 000 mPa·s)within the range of 90- 215 ℃,and could fully meet the technological requirements of RTM(resin transfermolding). The gelation temperature,curing temperature and post-processing temperature of the resin system were210.7,254.7,287.7 ℃ respectively,its apparent activation energy,frequency factor and reaction order of the curingsystem were 209.79 kJ/mol,3.23×1018s-1and 0.955(approximate level 1-reaction)respectively.
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