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CCGA Package Characteristic and it’s Applications for Space Products
Author(s): 
Pages: 222-226
Year: Issue:  4
Journal: Electronics Process Technology

Keyword:  Package characteristicThermal fatigue lifeAssembly designAssembly process;
Abstract: The composition of ceramic column grid array package and three kind of column attach techniques have been introduced. How to realize large dimension package which have high interconnection density high electrical performance and high reliability are described particularly. The board-level thermal cycle testing proved that CCGA technology meets or exceeds the reliability requirements of typical satellite program applications. The compressive loads which bring pressure to bear on CCGA appear to have a large effect on reliability while it exceed the limit. The critical element of PCB pad design and critical process of board-level assembly are also presented.
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