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Effect of Temperature on Reaction Rules between Active Agent used in Lead-free Solder Paste and Solder Material of Sn0.3Ag0.7Cu
Author(s): 
Pages: 190-193,197
Year: Issue:  4
Journal: Electronics Process Technology

Keyword:  Solder pasteActive agentQuality changeReaction rules;
Abstract: Add a certain tin into the solvent which contained MPEG400 and a variety of active agent, and the time of heat preservation is one hour. Examine the quality change of tin, confirm the reaction degree of active agent and solder materials under different temperature, and then check the reaction profile by SEM. The experiment results show that: malic acid and solder material of Sn0.3Ag0.7Cu occur acute chemical reaction when the temperature is above 150℃; malonic acid and solder material of Sn0.3Ag0.7Cu have the maximum reaction activity at 100℃, and when the temperature is above 125℃, the activity decreased; triethanolamine solder material of Sn0.3Ag0.7Cu alleviate chemical reaction, and the reaction activity increases with rising temperature. Discusse the effect of temperature on reaction rules between active agent and solder material of Sn0.3Ag0.7Cu, has important guiding significance for research on soldering flux.
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