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Image processing method for measurement of wetting angle
Pages: 194-197
Year: Issue:  4
Journal: Electronics Process Technology

Keyword:  Contact angleYoung-Laplace equationImage processing;
Abstract: The contact angle is an important parameter quantifying the wettability of a solid surface by a liquid. The contact angles of the solder, the flux, the solder pad and solder mask plays an important role in welding procedure in electronic manufacturing. The methods available for droplet contact angle measurement though image processing is not accuracy enough. To deal with this problem, propose a novel contact angle measurement method based on the Young-Laplace equation. This method uses the observed height and volume of a droplet for the contact angle evaluation. Experiments show that the proposed method outperforms traditional methods in measurement accuracy. Furthermore, this method significantly reduces the effects of gravity, droplet volume, and light reflection interference on the measurement results.
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