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Effect of Storage Period on Solderability of Pins on IC Component
Pages: 227-229,241
Year: Issue:  4
Journal: Electronics Process Technology

Keyword:  StoragePins of ICAgingSolderability;
Abstract: Effect of storage period on solderability of pins on plastic package IC component was studied. Designed aging storage for two kinds of plating on component’ pins. Then experimented and analyzed the test data, obtained the change of the solderability and the plating aging degree with the storage. Consequently, provided the criterion for establish the logical storage term of components.
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