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Study on Effect of Crystal Type on Fatigue Fracture of BGA Solder Joint
Pages: 210-213
Year: Issue:  4
Journal: Electronics Process Technology

Keyword:  SubmodelingBGACrystal TypeFatigue Fracture;
Abstract: Submodeling is applied to calculate the stress and strain of both monocrystalline and polycrystallime of Pb-free BGA solder joint by ANSYS, which is a finite element analysis software, combined with pictures of the cross-section of solder joints obtained by scanning electronic microscope (SEM). The effect of different types of crystal on the fatigue fracture of BGA solder joint is investigated. And the type of crystal is one of key factors which make an effect on the fatigue fracture of Lead-free BGA solder joint.
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