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High Reliability Assembly of CQFP
Author(s): 
Pages: 230-233
Year: Issue:  4
Journal: Electronics Process Technology

Keyword:  Ceramic Quad Flat PackLead formingStickingLead coplanarityReworking;
Abstract: CQFP with high reliability has a wide range of applications in the field of military, aviation, aerospace, but it is prone to deviation from the bonding pad, the pin deformation and cracking of solder joints in the actual assembly. These are the problems that must be solved and prevented. Expound the characteristics of CQFP, analyze the main processes that influence assembly reliability of CQFP, give out the matters needing attention and some concrete implementation method of assembly. Also enumerate some of the common defects of CQFP assembly, analyze the reasons, and give out effective solutions.
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