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Overview of microwave joining
Author(s): 
Pages: 16-20
Year: Issue:  z2
Journal: THE CHINESE JOURNAL OF NONFERROUS METALS

Keyword:  微波焊接陶瓷介电损耗;
Abstract: 阐述了微波焊接过程中微波和物质作用的机理、陶瓷的升温特征、实验装置的优化以及近年来国内外微波焊接陶瓷的发展状况, 分析了焊接过程中存在的问题, 并对微波焊接作出了展望.
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