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Theory Analysis of Vacuum Evaporation of Thin Film with Uniform Thickness Hemispherical Substrate
Author(s): 
Pages: 320-324
Year: Issue:  4
Journal: Chinese Journal of Vacuum Science and Technology

Keyword:  Thickness uniformityHemispherical substrateFilm depositionTheory analysis;
Abstract: The synthesis of coatings,grown by vacuum evaporation on hemispherical substrate,was physically modeled and analytically investigated.First,the formulae,describing the film thickness distribution deposited with a pointsourceon the stationary substrate,were derived.Next,the film thickness distribution on the substrate spinning on its vertical axiswas calculated.And finally,with these formulae the uniformity of film thickness distribution on the hemispherical surface was calculated by evaluating the relative film thickness.The"blind" area on substrate was evaluated,where the film fails to be deposited because the distance between the evaporation source and substrate center(with h and n denoting the vertical and horizontal components of the distance,respectively)is smaller than substrate radius(R).The calculated results show that the source geometry and ratios of h/ R and n/ R strongly affect the film thickness distribution.We suggest thatwhen it comes to growth of filmwith uniform thicknessin a small area,an optimized alignmentof the hemispherical substrate and a right type of source may do a good job.
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