Author(s): ZHOU Wenmu, XU Jiedong, WU Meizhu, WU Xiaolong, LIU Qiuhua
Pages: 6-9,15
Year: 2014 Issue:  2
Journal: Electronic Components & Materials
Keyword:  IC package substrate; ultra-fine lines; review; semi-additive process; pattern transfer; exposure; flash etching;
Abstract: 概述了目前超高精细线路制作的减成法、加成法、半加成法.针对减成法在倒装芯片球栅阵列封装和倒装芯片级封装积层精细线路制造中存在的缺点,重点介绍了超高精细线路半加成及改进的半加成工艺,并从精细线路制造角度分析了曝光、快速蚀刻等关键流程,展望了后续超高精细线路半加成工艺的发展方向.