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Studies on Flux-free Soldering Technology
Author(s): 
Pages: 19-21,25
Year: Issue:  1
Journal: Electronics Process Technology

Keyword:  Flux-free solderingWetting and SpreadingReducing atmospherePlasma treatment;
Abstract: With the development of miniaturization, lightweight and integration in electronic packaging, interconnection space of microelectronic device have been decreased;meanwhile, the requirements of device’s reliability have been increased. For excellent electrical, mechanical and thermal properties, the solder joint become to one of the most important way in electronic packaging and interconnection. Because no flux residues in device, the flux-free soldering has been used in optoelectronic device and flip-chip widely. The principle and processing of flux-free soldering was introduced, and pointed out that the reducing atmosphere protection and plasma treatment was two main ways. Based on the above analysis, the wetting and spreading of solder was studied by flux-free soldering, the results shown that the wetting and spreading properties of soldering were improved by reducing atmosphere and plasma treatment during soldering.
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