The server is under maintenance between 08:00 to 12:00 (GMT+08:00), and please visit later.
We apologize for any inconvenience caused
Login  | Sign Up  |  Oriprobe Inc. Feed
China/Asia On Demand
Journal Articles
Bookmark and Share
Study on QFP, FP, 3D Removing Process with Hot Air Rework Station
Pages: 37-41
Year: Issue:  1
Journal: Electronics Process Technology

Keyword:  Repair workstationComponent remove3D;
Abstract: Hot air rework station has bottom heater, top heater and local heater, adopts non-contact hot air convection to heat, and repair Surface Mounted Device (SMD). The hot air gun was mostly used to melt the soldering joint of QFP, FP and 3D which will be repaired, and then the device was replaced manually, this way is inefficiency and uncontrollable. Hot air reworkstation can remove QFP, FP and 3D efficiently with proper parametersand will not damage the nearby component, pad and PCB.
Related Articles
No related articles found