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Application of Green Chips Tumbling in MLCC Manufacturing
Pages: 367-370
Year: Issue:  6
Journal: Electronics Process Technology

Keyword:  MLCC (Multi-layer Chip Ceramic Capacitor)Green chipTumblingDelamination;
Abstract: New tumbling technique for MLCC green chips will help a lot on re-manufacturing the current MLCC processes, and solve problems affecting product quality, such as delamination inside the chips and cracks of the cover layer caused by the internal damage to fired chips after the tumbling process, and chipped out corners etc. The new tumbling techniques can simplify MLCC manufacturing processes, and shorten the processing cycle.
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