The server is under maintenance between 08:00 to 12:00 (GMT+08:00), and please visit later.
We apologize for any inconvenience caused
Login  | Sign Up  |  Oriprobe Inc. Feed
China/Asia On Demand
Journal Articles
Laws/Policies/Regulations
Companies/Products
Bookmark and Share
Soldering Technology with Lead-free and Lead Materials
Author(s): 
Pages: 356-358
Year: Issue:  6
Journal: Electronics Process Technology

Keyword:  Lead-freeMixed assemblySolderingCompatibilityTemperature profile;
Abstract: Aiming at the situation of mixed assembly with lead-free and lead materials, introduce the problem brought by mixed assembly. The primary problem is compatibility between lead and lead-free. Because of difference of melting point between the two materials, need to change the temperature profile. Put forward the effective method to set the compatibility temperature profile. At the same time, give out the optimized temperature profile and the reliability verification results with experiment.
Related Articles
No related articles found