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Soldering Technology with Lead-free and Lead Materials
Pages: 356-358
Year: Issue:  6
Journal: Electronics Process Technology

Keyword:  Lead-freeMixed assemblySolderingCompatibilityTemperature profile;
Abstract: Aiming at the situation of mixed assembly with lead-free and lead materials, introduce the problem brought by mixed assembly. The primary problem is compatibility between lead and lead-free. Because of difference of melting point between the two materials, need to change the temperature profile. Put forward the effective method to set the compatibility temperature profile. At the same time, give out the optimized temperature profile and the reliability verification results with experiment.
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